TLY-5 2-Layer 10mil High-Frequency Thin PCB with Immersion Gold
1.Introduction
TLY-5 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix in the TLY-5 material yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.
2.Key Features
Dielectric constant of 2.2 with tight tolerance 0.02 at 10 GHz/23°C
0.0009 loss tangent at 10GHz
Density (specific gravity) of 2.19 g/cm3
Moisture Absorption 0.02%
CTE in X-axis of 26 ppm/°C, Y-axis of 15 ppm/°C and Z-axis of 217 ppm/°C
3.Benefits
Dimensionally stable
Lowest DF
Low moisture absorption
High copper peel strength
Uniform & consistent DK
4.PCB Construction Details
| Specification | Value |
|---|---|
| Base Material | TLY-5 |
| Layer Count | 2 layers |
| Board Dimensions | 55mm × 50mm (±0.15mm) |
| Minimum Trace/Space | 6/8 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 µm
TLY-5 – 0.254 mm (10mil)
Copper layer 2 – 35 µm
6.PCB Statistics:
Components: 9
Total Pads: 41
Thru Hole Pads: 23
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 17
Nets: 2
7.Typical Applications
Automotive Radar
Satellite/Cellular Communications
Power Amplifiers
LNBs, LNAs, LNCs
Aerospace
Ka, E and W band Applications
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
